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TexasInstrumentshasbeenmakingprogresspossiblefordecades.Weareaglobalsemiconductorcompanythatdesigns,manufactures,testsandsellsanalogandembeddedprocessingchips.

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Analog|Embeddedprocessing|Semiconductorcompany|TI.comInternetExplorerisnotasupportedbrowserforTI.com.Forthebestexperience,pleaseuseadifferentbrowser.closeMenuProductsCloseAmplifiersAudio,haptics&piezoBatterymanagementICsClocks&timingDataconvertersDLP®productsInterfaceIsolationLogic&voltagetranslationMicrocontrollers(MCUs)&processorsMotordriversPassive&discretePowermanagementRFµwaveSensorsSwitches&multiplexersWirelessconnectivityNewproductsProductsbyapplicationsortechnologiesDie&waferservicesCalculators&educationtechnologyCrossreferencesearchAmplifiersAudio,haptics&piezoBatterymanagementICsClocks&timingDataconvertersDLP®productsInterfaceIsolationLogic&voltagetranslationMicrocontrollers(MCUs)&processorsBrowsebytechnologyDigitalpowerEdgeAIFunctionalsafetyIndustrialcommunicationMotorcontrolProductcybersecurityWirelessconnectivityMotordriversPassive&discretePowermanagementBrowsebyarchitectureBuck(stepdown)Buckboost&sepicBoost(stepup)BridgeDigitalpowerFlyback&flybuckGaNtechnologyMultiphasePFC&LLCPulsewidthmodulation(PWM)SynchronousrectificationFindpowerforembeddedsystemsTIcarriesarangeofsolutionsforyourprojectRFµwaveSensorsSwitches&multiplexersWirelessconnectivityBrowsebyarchitectureAmazonSidewalkBluetoothLowEnergyMattermiotyProprietarywirelessprotocolsThreadWiFi6WiSUNWirelessMBusWirelessmultiprotocolZigbeeProductsbyapplicationsortechnologiesApplicationsAerospace&defenseAutomotiveTechnologiesBAWresonatortechnologyCurrentsensingsolutionsDigitalI/OEdgeAIFunctionalsafetyGalliumnitride(GaN)IndustrialcommunicationIsolationMotorcontrolProductcybersecurityUSBTypeCVoltagesensingsolutionsApplicationsCloseAutomotive48VinautomotiveAdvanceddriverassistancesystems(ADAS)Bodyelectronics&lightingChassiscontrol&safetyHybrid,electric&powertrainsystemsInfotainment&clusterSoftwaredefinedvehicleCommunicationsequipmentBroadbandfixedlineaccessWirednetworkingWirelessinfrastructureDatacenterDatacentercomputeDatacenternetworkingRackpower&thermalmanagementIndustrialAerospace&defenseAppliancesBuildingautomationEnergyinfrastructureIndustrialautomationMedical&healthcarePowerdeliveryRoboticsTest&measurementPersonalelectronicsConnectedperipherals&printersDatastorageGamingHometheater&entertainmentMobilephonesPC¬ebooksPortableelectronicsTabletsTVWearables(nonmedical)ReferencedesignsFindreferencedesignsleveragingthebestinTItechnology–fromanalogandpowermanagementtoembeddedprocessorsAlldesignsincludeaschematic,testdataanddesignfilesTechnologiesBAWresonatortechnologyCurrentsensingsolutionsDigitalI/OEdgeAIFunctionalsafetyGalliumnitride(GaN)IndustrialcommunicationIsolationMotorcontrolProductcybersecurityUSBTypeCVoltagesensingsolutionsDesign&developmentCloseDesign&developmentDesign&simulationtoolsHardwaredesignOpensourcePackagingPartnerdirectoryReferencedesignsSoftwaredesignTIE2E™designsupportforumsFindanswersoraskourengineersanewquestion.EmbeddeddevelopmentArm®basedprocessorsArm®Cortex®M0+microcontrollersArm®Cortex®RmicrocontrollersC2000™realtimemicrocontrollersDLP®productsmmWaveradarsensorsMSP430™microcontrollersWirelessconnectivityDesign&developmenttoolsCodeComposerStudio™IDE&developmenttoolsPSpice®forTITIDeveloperZoneWEBENCH®CircuitDesignerEducationalresourcesAnalogDesignJournalEmbeddedAcademyPowerSupplyDesignSeminarPrecisionLabstrainingVideolibraryQuality&reliabilityClosePolicies&proceduresAnticounterfeitGeneralqualityguidelinesProductchangenotificationProductlifecycleProductsecurityvulnerabilitiesProductshelflifeQualitysystemmanualQuality,reliability&packagingdatadownloadViewordownloadreportswithmaterialcontent,devicemarking,MTBF/FITestimates,ongoingreliabilitymonitoring,andqualificationsummaryEnvironmentalinformationMaterialcontentsearchPackingmaterialinformationLeadfree(Pbfree)ReliabilityQualificationsummaryReliabilityterminologyReliabilitytestingMTBF/FITestimatorReliabilitycalculatorsOngoingreliabilitymonitoringCertifications&standardsCertificationsFunctionalsafetyIndustrystandardsIsolationcertificationsPartratingsProductcybersecurityAdditionalinformationMoisturesensitivitylevelsearchQuality,reliabilityandpackagingFAQsFailureanalysisCustomerreturnsPartmarkinglookupAutomotivePPAPOrderingresourcesCloseBuyingwithTImyTIcompanyaccountsOrderhistoryShipping,payment&taxesPurchaseorderautomationHighreliabilityproductsTIAPIsuitesTIAPIdeveloperportalTIAPIsupportAPIhowtovideoseriesTools&informationCrossreferencesearchMaterialattributesearchCarrierpackagingoptionsImportdetailsOrderingsupportOrderingFAQsCustomersupportcenterAboutTICloseCompanyWhatwedoWhoweareTIataglanceManufacturingLeadershipEventsContactusNewsroomNewsreleasesMediaresourcesCompanyblogInvestorrelationsFinancialinformationStockinformationInvestorresourcesGovernanceInvestoreventsInvestornewsCorporatecitizenshipEnvironmentalsustainabilityResponsiblebusinesspracticesGiving&volunteeringPublicpolicyReporting&disclosuresCareersSearchjobsViewlocationsSearchCloseSearchmyTICloseLanguageCloseRegionalpreferencesMycartCloseThefuturestartswiththefirstOurnewest300mmfab,inSherman,Texas,isnowinproduction,markinganimportantmilestoneaswebuildthetechnologytheworldreliesontodayanddreamsoftomorrowReadnowThenewestAnalogDesignJournalisoutnowLearnthelatestonanalogcircuitdesignandemergingapplicationsfromourtechnicalexpertsReadnowThetechnologyshapingtheautonomousdrivingexperienceFromadvancingsafetywithsensorfusiontoenhancingconveniencewithovertheairupdates,ourautomotivetechnologiesarebuildingthefoundationfortomorrow’sautonomousvehiclesReadmoreInnovatewhat’snextatCES2026 January69AtCES2026,wereinnovatingwhatsnextinhowwemove,liveandwork–transformingautomotiveexperiences,bringingedgeAIcapabilitiestoeverydayenvironmentsandreimaginingwhat’snextinautomationandAILearnmore Getsupport Findreferencedesigns Design&development CrossreferencesearchNewproductsViewallnewproducts=3*/TPS1686NEWeFuses(integratedhotswaps)TPS1686ACTIVE9Vto80V,15mΩ,10AeFusewithaccurateandfastcurrentmonitorApprox.price(USD)1ku|2REF30ENEWSeriesvoltagereferencesREF30EACTIVE20ppm°/Cdrift,24uAIqinSOT233packageseriesvoltagereferenceApprox.price(USD)1ku|0.39LMG5126NEWAC/DC&DC/DCconverters(integratedFET)LMG5126ACTIVE42VVIN,2.5MHzsynchronousGaNboostconverterwithoutputvoltagetrackingApprox.price(USD)1ku|4TMUX182SEPNEWAnalog&precisionswitches&muxesTMUX182SEPPREVIEWRadiationTolerant,8:1,onechannelmultiplexerwith1.8VLogicBZX884C6V8Q1NEWZenerdiodesBZX884C6V8Q1ACTIVEAutomotive6.8VZenerdiodein0402packageApprox.price(USD)1ku|0.03DP83TD530Q1NEWEthernetPHYsDP83TD530Q1PREVIEW10BASET1SOAPMDTransceiverApprox.price(USD)1ku|0.9Viewallnewproducts17DEC2025|COMPANYBLOGThefuturestartswiththefirst:Ournewest300mmwaferfabisinproductionThejourneytofirstproductioninSherman,TexasmarksanimportantmilestoneinTI’slegacyoffirstsaswebuildthetechnologytheworldreliesontodayanddreamsoftomorrowReadmoreOurpassionAtourcore,wehaveapassiontocreateabetterworldbymakingelectronicsmoreaffordablethroughsemiconductors.Thispassionisalivetodayaswecontinuetopioneeradvancesinintegratedcircuits.Eachgenerationofinnovationbuildsuponthelasttomaketechnologysmaller,moreefficient,morereliableandmoreaffordable–openingnewmarketsandmakingitpossibleforsemiconductorstogointoelectronicseverywhere.WethinkofthisasEngineeringProgress.arrowrightWhowearearrowrightWhatwedoJoinourteamOurworkischallengingandfastpaced,andit’sourpeoplethatmakeusgreat.Doyouwanttochangetheworldandloveyourjob?Joinus.Searchopenjobs OurcommitmenttocorporatecitizenshipdownloadDownloadour2024CorporateCitizenshipReport90%Percentageofshippedsemiconductorproductsconsideredgreenthatmeetlowhalogenindustryrequirements.31%ofwaterwasreusedbyourglobalmanufacturingoperationsin2024.30+Honorsfortalentdevelopmentandworkforceprograms.29%Reductionofourgreenhousegas(GHG)emissionsfrom2015to2024makingprogresstowardsour25%reductiongoal.88%ofsolidwastematerialsgeneratedweredivertedfromlandfillsin2024.$57millioninphilanthropicgiving,inpartnershipwiththeTIFoundation,TIemployeesandretirees,tosupportourlocalcommunities.*Numbersaccurateasof2024

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